3M™ Wafer Support Systems

Enables conventional backgrinding equipment to be used to produce ultra-thin wafers with less cracking, edge chipping and increased die yields. Faster grinding speeds and higher pressures can be used resulting in shorter process times. The system includes all the equipment and consumables necessary for mounting, demounting and removing adhesive from the wafer.
SKU Product name   Price  
3M 3305 PL Wafer De-taping Tape 3305, 25 mm x 100 m 3M 3305 PL Wafer De-taping Tape 3305, 25 mm x 100 m
  • 28% off
Market price: $2114.41,
  • $1522.37
  • 28% off